Tssop14l
WebSOP封装工艺流程介绍. Theory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag…) 170°C烘烤8小时， 90~95°C蒸汽老化10小 时。. 锡覆盖率≥95%. Purpose： Remove the dem-bar of leadframe. Purpose: To plating Sn on the lead which will mount on board pad. Purpose ... WebTSSOP14 產品封裝資訊 臺灣東芝電子零組件股份有限公司 台灣. 半導體&儲存產品首頁. Semiconductor. 開發 / 設計支援. Package & Packing Information. 產品詳細.
Tssop14l
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WebImages are for reference only See Product Specifications. Kynix Part #: KY32-74VT74AMTCX Manufacturer Part #: 74VT74AMTCX WebTSSOP14L; Product Categories : Integrated Circuits (ICs) Datasheet: AF622L-A2G1Z PDF; RoHs Status: Lead free/RoHS Compliant; In-stock: 416; Product comparison. Quantity Add To BOM Inquiry. Request for Quotation ...
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